Re: [PATCH v3 2/8] soc: qcom: Add support for QMI TMD cooling devices

[Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>]

On 6/9/26 13:30, Dmitry Baryshkov wrote:
> On Tue, Jun 09, 2026 at 03:52:57PM +0530, Gaurav Kohli wrote:
>> From: Casey Connolly <casey.connolly@linaro.org>
>>
>> Add a Qualcomm QMI Thermal Mitigation Device (TMD) to support thermal
>> cooling devices backed by remote subsystems.
>>
>> On several Qualcomm platforms, remote processors (for example modem and
>> CDSP) expose thermal mitigation controls through the TMD QMI service.
>> Client drivers need a way to discover that service, map DT thermal
>> mitigation endpoints to cooling devices, and forward cooling state
>> updates to the remote subsystem.
>>
>> Co-developed-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>> Signed-off-by: Casey Connolly <casey.connolly@linaro.org>
>> Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
> 
> Wrong SoB chain.

I think Gaurav wanted to reflect the changes did a back and forth 
between us, so I ended up in the delivery path somehow. I guess adding 
Co-developped-by should fix the SoB but won't reflect Gaurav and Casey 
did actually most of the work. So I'm fine if we remove my SoB to fix 
the chain