Re: [PATCH v3 3/8] remoteproc: qcom: pas: register TMD thermal cooling devices

[Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>]

On 6/9/2026 5:33 PM, Konrad Dybcio wrote:
> On 6/9/26 12:22 PM, Gaurav Kohli wrote:
>> Add support for Thermal Mitigation Devices (TMDs) to enable
>> thermal throttling of remote processors through QMI.
>>
>> This enables the thermal framework to request mitigation when remote
>> subsystems (modem, CDSP) contribute to thermal issues.
>>
>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>> Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
> 
> There's no other signs of Daniel in this patch, please fix the
> tags chain
> 
> [...]
> 

Thanks Konrad for review, will fix this.

>> +static int qcom_pas_setup_tmd(struct qcom_pas *pas)
>> +{
>> +	struct device *dev = pas->dev;
>> +	struct device_node *np = dev->of_node;
>> +	const char **tmd_names;
>> +	int num_tmds, ret, i;
>> +
>> +	if (!of_find_property(np, "tmd-names", NULL))
> 
> Let's use device_property_present() instead
> 

Ack.

>> +		return 0;
>> +
>> +	/* Get the TMD names array */
>> +	num_tmds = of_property_count_strings(np, "tmd-names");
> 
> Is this something we can stuff into platform_data for a given rproc on a
> given SoC (for which we already store *some* data in the PAS driver)?
> 

Without tmd-names in DT, it is unclear which index corresponds to which 
binding. With #cooling-cells, tmd-names in DT provides an explicit 
name-to-index mapping. Please suggest.
> Konrad