Re: [PATCH v3 2/8] soc: qcom: Add support for QMI TMD cooling devices

[Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>]

On 6/10/26 15:42, Dmitry Baryshkov wrote:
> On Tue, Jun 09, 2026 at 02:08:57PM +0200, Daniel Lezcano wrote:
>> On 6/9/26 13:30, Dmitry Baryshkov wrote:
>>> On Tue, Jun 09, 2026 at 03:52:57PM +0530, Gaurav Kohli wrote:
>>>> From: Casey Connolly <casey.connolly@linaro.org>
>>>>
>>>> Add a Qualcomm QMI Thermal Mitigation Device (TMD) to support thermal
>>>> cooling devices backed by remote subsystems.
>>>>
>>>> On several Qualcomm platforms, remote processors (for example modem and
>>>> CDSP) expose thermal mitigation controls through the TMD QMI service.
>>>> Client drivers need a way to discover that service, map DT thermal
>>>> mitigation endpoints to cooling devices, and forward cooling state
>>>> updates to the remote subsystem.
>>>>
>>>> Co-developed-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>>>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>>>> Signed-off-by: Casey Connolly <casey.connolly@linaro.org>
>>>> Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
>>>
>>> Wrong SoB chain.
>>
>> I think Gaurav wanted to reflect the changes did a back and forth between
>> us, so I ended up in the delivery path somehow. I guess adding
>> Co-developped-by should fix the SoB but won't reflect Gaurav and Casey did
>> actually most of the work. So I'm fine if we remove my SoB to fix the chain
> 
> Anyway, Gaurav's SoB should be the last one (and it should be preceeded
> by the CdB tag)

Ah yes, right :)