From: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
To: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>,
Krzysztof Kozlowski <krzk@kernel.org>
Cc: Bjorn Andersson <andersson@kernel.org>,
Mathieu Poirier <mathieu.poirier@linaro.org>,
Rob Herring <robh@kernel.org>,
Krzysztof Kozlowski <krzk+dt@kernel.org>,
Conor Dooley <conor+dt@kernel.org>,
Amit Kucheria <amit.kucheria@oss.qualcomm.com>,
Manivannan Sadhasivam <mani@kernel.org>,
Konrad Dybcio <konradybcio@kernel.org>,
Kees Cook <kees@kernel.org>,
"Gustavo A. R. Silva" <gustavoars@kernel.org>,
cros-qcom-dts-watchers@chromium.org,
linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org,
devicetree@vger.kernel.org, linux-kernel@vger.kernel.org,
linux-pm@vger.kernel.org, linux-hardening@vger.kernel.org,
Manaf Meethalavalappu Pallikunhi
<manaf.pallikunhi@oss.qualcomm.com>
Subject: Re: [PATCH v3 1/8] dt-bindings: remoteproc: qcom,pas: add thermal mitigation properties
Date: Mon, 15 Jun 2026 12:34:56 +0200 [thread overview]
Message-ID: <3cbcaf8c-357e-42d2-91c1-9d1a32c55ed0@oss.qualcomm.com> (raw)
In-Reply-To: <ec65893d-873a-4a62-b0e2-5008b2130545@oss.qualcomm.com>
On 6/13/26 13:05, Gaurav Kohli wrote:
>
>
> On 6/13/2026 1:11 PM, Krzysztof Kozlowski wrote:
>> On 12/06/2026 15:52, Gaurav Kohli wrote:
>>>
>>>
>>> On 6/11/2026 5:53 PM, Krzysztof Kozlowski wrote:
>>>> On 11/06/2026 13:12, Gaurav Kohli wrote:
>>>>>> Why? And where is this generic property defined? You cannot just
>>>>>> sprinkle generic properties in random bindings.
>>>>>>
>>>>>
>>>>> Ack, will add why part.
>>>>> These names are matched with the thermal mitigation device identifiers
>>>>> populated by remote firmware over QMI and define mitigation devices
>>>>> are
>>>>> exposed as cooling devices.
>>>>
>>>> No, -names correspond to values passed via DT, not some remote
>>>> firmware.
>>>> The remote firmware should give you interface which is explicit and
>>>> does
>>>> not need such properties.
>>>
>>> thanks Krzysztof for review, We need tmd-names because of following
>>> reasons:
>>>
>>> Following Daniel's series [1], the thermal framework supports
>>> mapping multiple cooling devices per remoteproc/device via indexed
>>> cooling-cells.
>>>
>>> 1) The thermal framework's cooling-maps reference
>>> cooling devices by index (for #cooling-cells = <3>). Without tmd-names,
>>> there's no way to know which index corresponds to which TMD, as firmware
>>> may return tmd-names in any order.
>>>
>>> below are the changes post new thermal mapping changes:
>>> DT: tmd-names = "cdsp_sw", "xyz";
>>> Firmware: ["cdsp_sw", "xyz1", "xyz2",]
>>> Driver registers: Only "cdsp_sw" (index 0) and "xyz" (index 1)
>>
>> names property are not to instruct drivers to register or not to
>> register something.
>>
>> I don't understand the problem and explanation in the binding is
>> basically non-existing.
>>
>> Remember that all lists and indices ARE FIXED, so driver knows exactly
>> which index means what.
>>
>
> thanks for review, shall i use driver data, which is basically pas data
> structure like below:
>
> static const struct qcom_pas_data {
> .crash_reason_smem = 601,
> .firmware_name = "cdsp.mdt",
> .tmd_names = (const char *[]){"xyz", NULL},
> .num_tmds = 1,
>
> Is something like above acceptable? and this will also help to filter
> tmd names as well?
How the thermal framework will bind the thermal zone with the TMD ?
(node pointer, id) ?
next prev parent reply other threads:[~2026-06-15 10:35 UTC|newest]
Thread overview: 49+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-06-09 10:22 [PATCH v3 0/8] Add support for Qualcomm remoteproc subsystem cooling Gaurav Kohli
2026-06-09 10:22 ` [PATCH v3 1/8] dt-bindings: remoteproc: qcom,pas: add thermal mitigation properties Gaurav Kohli
2026-06-09 10:47 ` Dmitry Baryshkov
2026-06-10 12:02 ` Gaurav Kohli
2026-06-10 7:31 ` Krzysztof Kozlowski
2026-06-11 11:12 ` Gaurav Kohli
2026-06-11 12:23 ` Krzysztof Kozlowski
2026-06-12 13:52 ` Gaurav Kohli
2026-06-13 7:41 ` Krzysztof Kozlowski
2026-06-13 11:05 ` Gaurav Kohli
2026-06-15 5:03 ` Krzysztof Kozlowski
2026-06-15 10:34 ` Daniel Lezcano [this message]
2026-06-15 12:12 ` Gaurav Kohli
2026-06-15 12:30 ` Daniel Lezcano
2026-06-15 14:11 ` Dmitry Baryshkov
2026-06-15 14:33 ` Daniel Lezcano
2026-06-15 15:14 ` Dmitry Baryshkov
2026-06-15 15:33 ` Daniel Lezcano
2026-06-15 22:15 ` Dmitry Baryshkov
2026-06-17 12:32 ` Konrad Dybcio
2026-06-19 12:16 ` Daniel Lezcano
2026-06-16 4:21 ` Krzysztof Kozlowski
2026-06-18 7:17 ` Daniel Lezcano
2026-06-24 10:42 ` Krzysztof Kozlowski
2026-06-24 15:56 ` Daniel Lezcano
2026-06-25 6:48 ` Krzysztof Kozlowski
2026-06-25 7:51 ` Daniel Lezcano
2026-06-29 14:31 ` Gaurav Kohli
2026-06-09 10:22 ` [PATCH v3 2/8] soc: qcom: Add support for QMI TMD cooling devices Gaurav Kohli
2026-06-09 11:30 ` Dmitry Baryshkov
2026-06-09 12:08 ` Daniel Lezcano
2026-06-10 13:42 ` Dmitry Baryshkov
2026-06-10 14:15 ` Daniel Lezcano
2026-06-11 10:53 ` Gaurav Kohli
2026-06-11 22:50 ` Dmitry Baryshkov
2026-06-09 10:22 ` [PATCH v3 3/8] remoteproc: qcom: pas: register TMD thermal " Gaurav Kohli
2026-06-09 11:05 ` Dmitry Baryshkov
2026-06-09 12:03 ` Konrad Dybcio
2026-06-11 4:45 ` Gaurav Kohli
2026-06-11 20:34 ` Dmitry Baryshkov
2026-06-09 10:22 ` [PATCH v3 4/8] arm64: dts: qcom: kodiak: Enable CDSP & Modem cooling Gaurav Kohli
2026-06-09 10:57 ` Dmitry Baryshkov
2026-06-15 5:32 ` Gaurav Kohli
2026-06-15 15:25 ` Dmitry Baryshkov
2026-06-29 14:43 ` Gaurav Kohli
2026-06-09 10:23 ` [PATCH v3 5/8] arm64: dts: qcom: lemans: Enable CDSP cooling Gaurav Kohli
2026-06-09 10:23 ` [PATCH v3 6/8] arm64: dts: qcom: talos: " Gaurav Kohli
2026-06-09 10:23 ` [PATCH v3 7/8] arm64: dts: qcom: monaco: " Gaurav Kohli
2026-06-09 10:23 ` [PATCH v3 8/8] arm64: dts: qcom: hamoa: " Gaurav Kohli
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